Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/154028
Title: SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES
Authors: CHIN CHIAM CHUANG
Keywords: moisture diffusivity
saturated moisture concentration
coefficient of moisture expansion
hygroscopic swelling
thermal expansion
vapor pressure
interface delamination
Issue Date: 2003
Citation: CHIN CHIAM CHUANG (2003). SIMULATION AND CHARACTERIZATION ON MOISTURE SENSITIVITY PERFORMANCE FOR ELECTRONIC PACKAGES. ScholarBank@NUS Repository.
Abstract: Polymeric materials swell upon absorbing moisture and this differential swelling of polymeric materials with non-polymeric materials induces hygroscopic stress in an IC package. Moisture diffusivity, saturated moisture concentration, and coefficient of moisture expansion of polymeric materials of a LFBGA package were characterized in order to evaluate the hygroscopic swelling during moisture pre-conditioning and also the vapor pressure created during reflow. Combining with the thermal stress at high reflow temperature, the vulnerability of the package to interface delamination, subjected to moisture sensitivity test, was analyzed using finite element analysis. CSAM and cross sectioning inspections, and the FEA results had correlated well.
URI: https://scholarbank.nus.edu.sg/handle/10635/154028
Appears in Collections:Master's Theses (Restricted)

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