Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/153910
Title: SPATIAL SIGNATURE AUTO TRIGGER
Authors: SOON CHIAN MYAU
Issue Date: 2007
Citation: SOON CHIAN MYAU (2007). SPATIAL SIGNATURE AUTO TRIGGER. ScholarBank@NUS Repository.
Abstract: This report is regarding my industrial attachment at Systems on Silicon Manufacturing Co. Pte. Ltd. from July 2007 to December 2007. Klarity SSA is a stand-alone application used to identify process related spatial signatures that are causing potential yield issues. Klarity SSA connects to UDB database (Klarity Defect) or gets data from KLARF files for analysis. Klarity SSA can work in a real time basis for monitoring process related to spatial signatures that maybe overlook due to its weak signal. The main task I was given is to setup Klarity SSA (auto spatial signature analysis) on the inspection tools to auto trigger wafers with spatial signatures. I need to setup the scanning recipes for the Klarity SSA and evaluate its final performance in detecting the spatial signatures. The target is to reduce the number of wafers scrapped or low yield by early detection of process issue through defect spatial signature identification and triggering especially on those Non Out of Control wafers through the current SSMC monitoring system. Besides, Excel VBA programming skill has been learned and several macros were written to automate the time consuming Excel tasks.
URI: https://scholarbank.nus.edu.sg/handle/10635/153910
Appears in Collections:Master's Theses (Restricted)

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