Expanded Papers From the 2003 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Please use this identifier to cite or link to this item: https://doi.org/10.1109/TDMR.2004.826387

DC Field	Value
dc.title	Expanded Papers From the 2003 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
dc.contributor.author	Pey, K.L.
dc.contributor.author	Radhakrishnan, M.K.
dc.contributor.author	Trigg, A.
dc.date.accessioned	2014-12-12T07:15:24Z
dc.date.available	2014-12-12T07:15:24Z
dc.date.issued	2004-03
dc.identifier.citation	Pey, K.L., Radhakrishnan, M.K., Trigg, A. (2004-03). Expanded Papers From the 2003 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). IEEE Transactions on Device and Materials Reliability 4 (1) : 4-. ScholarBank@NUS Repository. https://doi.org/10.1109/TDMR.2004.826387
dc.identifier.issn	15304388
dc.identifier.uri	http://scholarbank.nus.edu.sg/handle/10635/115420
dc.description.uri	http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/TDMR.2004.826387
dc.source	Scopus
dc.type	Conference Paper
dc.contributor.department	INSTITUTE OF MICROELECTRONICS
dc.description.doi	10.1109/TDMR.2004.826387
dc.description.sourcetitle	IEEE Transactions on Device and Materials Reliability
dc.description.volume	4
dc.description.issue	1
dc.description.page	4-
dc.identifier.isiut	000220708500001
Appears in Collections:	Staff Publications

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