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Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/112963
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dc.titleDetecting underfill delamination and cracks in flip chip on board assemblies using infrared microscope
dc.contributor.authorLu, J.
dc.contributor.authorTrigg, A.
dc.contributor.authorWu, J.
dc.contributor.authorChai, T.
dc.date.accessioned2014-11-28T08:12:45Z
dc.date.available2014-11-28T08:12:45Z
dc.date.issued1998-09
dc.identifier.citationLu, J.,Trigg, A.,Wu, J.,Chai, T. (1998-09). Detecting underfill delamination and cracks in flip chip on board assemblies using infrared microscope. International Journal of Microcircuits and Electronic Packaging 21 (3) : 231-236. ScholarBank@NUS Repository.
dc.identifier.issn10631674
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/112963
dc.description.abstractInfrared Microscopy (IRM) inspection of underfill delamination and cracks in Flip Chip board (FCOB) assemblies is reported in this work. The location and extent of chip/underfill delamination has been determined. Internal cracks in underfill can also be detected by IRM. Compared to scanning acoustic microscopy (SAM), IRM technique provides higher resolution images of underfill related failures and eliminates the `edge effect' which occurs in SAM. Underfill failures detected by IRM have been verified by destructive physical analysis, microscopy, and scanning electronic microscopy (SEM).
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentINSTITUTE OF MICROELECTRONICS
dc.description.sourcetitleInternational Journal of Microcircuits and Electronic Packaging
dc.description.volume21
dc.description.issue3
dc.description.page231-236
dc.description.codenIMICD
dc.identifier.isiutNOT_IN_WOS
Appears in Collections:Staff Publications

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