Please use this identifier to cite or link to this item: https://doi.org/10.1002/mmce.20063
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dc.titleAverage power-handling capability of the signal line in coplanar waveguides on polyimide and GaAs substrates including the irregular line edge shape effects
dc.contributor.authorYin, W.-Y.
dc.contributor.authorZhang, Y.
dc.contributor.authorDong, X.
dc.contributor.authorGan, Y.B.
dc.date.accessioned2014-11-28T01:51:01Z
dc.date.available2014-11-28T01:51:01Z
dc.date.issued2005-03
dc.identifier.citationYin, W.-Y., Zhang, Y., Dong, X., Gan, Y.B. (2005-03). Average power-handling capability of the signal line in coplanar waveguides on polyimide and GaAs substrates including the irregular line edge shape effects. International Journal of RF and Microwave Computer-Aided Engineering 15 (2) : 156-163. ScholarBank@NUS Repository. https://doi.org/10.1002/mmce.20063
dc.identifier.issn10964290
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/111333
dc.description.abstractThe average power-handling capability (APHC) of the signal line in finite-ground coplanar waveguides (FGCPWs) on polyimide and GaAs substrates is evaluated in this paper. In our approach, the ohmic loss of metal lines is characterized in different ways, and the effects of an irregular edge shape are also considered. The rise in temperature of the signal line is determined by single- and double-layer thermal models, with the temperature-dependent properties of the thermal conductivity of GaAs material treated appropriately. Parametric studies are carried out to investigate the overall effects of signal-line width, thickness, conductivity, edge-shape angle, and polyimide thickness on APHC. Some possible ways to enhance the APHC of these FGCPWs are also proposed. © 2005 Wiley Periodicals, Inc.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1002/mmce.20063
dc.sourceScopus
dc.subjectAttenuation
dc.subjectAverage power handling capability (APHC)
dc.subjectDistributed parameters
dc.subjectFinite-ground coplanar waveguides (FGCPWs)
dc.subjectPolyimide and GaAs
dc.subjectThermal model
dc.typeArticle
dc.contributor.departmentTEMASEK LABORATORIES
dc.description.doi10.1002/mmce.20063
dc.description.sourcetitleInternational Journal of RF and Microwave Computer-Aided Engineering
dc.description.volume15
dc.description.issue2
dc.description.page156-163
dc.description.codenIJMEF
dc.identifier.isiut000227668300003
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