Please use this identifier to cite or link to this item: https://doi.org/10.1088/0268-1242/11/3/026
DC FieldValue
dc.titleOrientation anomalies in plating thickness measurements from advanced packaging substrates
dc.contributor.authorTan, N.X.
dc.contributor.authorLee, A.J.Y.
dc.contributor.authorBourdillon, A.J.
dc.contributor.authorTan, C.Y.S.
dc.date.accessioned2014-10-29T08:40:16Z
dc.date.available2014-10-29T08:40:16Z
dc.date.issued1996-03
dc.identifier.citationTan, N.X., Lee, A.J.Y., Bourdillon, A.J., Tan, C.Y.S. (1996-03). Orientation anomalies in plating thickness measurements from advanced packaging substrates. Semiconductor Science and Technology 11 (3) : 437-442. ScholarBank@NUS Repository. https://doi.org/10.1088/0268-1242/11/3/026
dc.identifier.issn02681242
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/107154
dc.description.abstractExperiments show that serious anomalies arise in the measurement by XRF of film thickness in bond fingers on packages. The anomalies can be exposed as a package orientation dependence in the film thickness measurement. The orientation anomalies occur on translation of the specimen between rows of bond fingers. The anomalies are due to either primary fluorescence or to scattered radiation from the substrate with an escape path to the detector. In bond fingers consisting of Au, Ni and Cu, primary fluorescence of substrate Br enhances the Au signal, while scattering of W characteristic lines enhances the Ni signal. The anomalies can be overcome by ensuring that the bond finger lies in the plane containing the x-ray source and the proportional counter detector so that substrate emissions are buried. Instrumental improvements are also suggested.
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentMATERIALS SCIENCE
dc.description.doi10.1088/0268-1242/11/3/026
dc.description.sourcetitleSemiconductor Science and Technology
dc.description.volume11
dc.description.issue3
dc.description.page437-442
dc.description.codenSSTEE
dc.identifier.isiutA1996TZ79700024
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