1. ScholarBank@NUS

Wu, Jianhua

rp08597

Collaboration Map View Statistics Email Alert RSS Feed

Profile

Full Name
Wu, Jianhua
Variants
Wu, J.H.
Wu, J.
 
Main Affiliation
 
Faculty
 

Publications

Refined By:
Department:  MECHANICAL ENGINEERING

Results 1-6 of 6 (Search time: 0.003 seconds).

Issue DateTitleAuthor(s)
12000Effect of delamination on the thermal fatigue of solder joints in flip chipsOng, E.T.; Tay, A.A.O. ; Wu, J.H. 
2Feb-1995Effect of wirebond geometry and die setting on wire sweepTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. 
31997Numerical simulation of the flip-chip underfilling processTay, A.A.O. ; Huang, Z.M. ; Wu, J.H. ; Cui, C.Q. 
41995Simulation of three-dimensional wirebond deformation during transfer moldingTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. 
5Mar-1995Wirebond deformation during molding of IC packagesTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. ; Lim, T.B. 
61993Wirebound deformation during molding of IC packagesTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. ; Lim, T.B.