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Li Xiaoping

rp08482

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Full Name
Li Xiaoping
(not current staff)
Variants
Li, X.
Li', X.P.
LI, XIAOPING
Li, Xiaoping
Li, X.P
Xiaoping, L.
Li, X.P.
Li, X.-P.
 
Main Affiliation
 
Faculty
 
Email
mpelixp@nus.edu.sg
 

Publications

Refined By:
Author:  Rahman, M.

Results 1-20 of 32 (Search time: 0.007 seconds).

Issue DateTitleAuthor(s)
12005A hybrid cutting force model for high-speed milling of titanium alloysWang, Z.G. ; Rahman, M. ; Wong, Y.S. ; Li, X.P. 
22004A study of the cutting modes in the grooving of tungsten carbideLiu, K.; Li, X.P. ; Rahman, M. ; Liu, X.D.
3Apr-2007A study of the effect of tool cutting edge radius on ductile cutting of silicon wafersLiu, K.; Li, X.P. ; Rahman, M. ; Neo, K.S. ; Liu, X.D.
4Dec-1996A three-dimensional model of chip flow, chip curl and chip breaking for oblique cuttingSeah, K.H.W. ; Rahman, M. ; Li, X.P. ; Zhang, X.D.
5Aug-2003CBN tool wear in ductile cutting of tungsten carbideLiu, K. ; Li, X.P. ; Rahman, M. ; Liu, X.D.
610-Sep-2007Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wearCai, M.B.; Li, X.P. ; Rahman, M. 
722-Sep-2003Characteristics of high speed micro-cutting of tungsten carbideLiu, K. ; Li, X.P. ; Rahman, M. 
8Jan-2008Characteristics of ultrasonic vibration-assisted ductile mode cutting of tungsten carbideLiu, K.; Li, X.P. ; Rahman, M. 
9Mar-2007Crack initiation in relation to the tool edge radius and cutting conditions in nanoscale cutting of siliconCai, M.B.; Li, X.P. ; Rahman, M. ; Tay, A.A.O. 
1022-Sep-2003Cutting performance of diamond tools during ultra-precision turning of electroless-nickel plated die materialsPramanik, A.; Neo, K.S. ; Rahman, M. ; Li, X.P. ; Sawa, M.; Maeda, Y.
11Oct-2004Effect of crystallographic orientation on wear of diamond tools for nano-scale ductile cutting of siliconUddin, M.S.; Seah, K.H.W. ; Li, X.P. ; Rahman, M. ; Liy, K.
122002Effect of cutting edge radius on ductile-brittle transition in cutting of silicon-wafersLi, X.P. ; Chan, C.C.; Liu, K. ; Rahman, M. ; Liu, X.D.
132007High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon waferCai, M.B.; Li, X.P. ; Rahman, M. 
142005Machined surface and subsurface in relation to cutting edge radius in nanoscale ductile cutting of siliconArefin, S.; Li, X.P. ; Rahman, M. ; He, T.
152007Molecular dynamics modelling and simulation of nanoscale ductile cutting of siliconCai, M.; Li, X. ; Rahman, M. 
162005Molecular dynamics simulation of the effect of tool edge radius on cutting forces and cutting region in nanoscale ductile cutting of siliconCai, M.B.; Li, X.P. ; Rahman, M. 
1722-Sep-2003Nano-precision measurement of diamond tool edge radius for wafer fabricationLi, X.P. ; Rahman, M. ; Liu, K. ; Neo, K.S. ; Chan, C.C.
182009Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond toolsLiu, K.; Zuo, D.; Li, X.P. ; Rahman, M. 
19Oct-2007Nanoscale cutting of monocrystalline silicon using molecular dynamics simulationLi, X. ; Cai, M.; Rahman, M. 
2022-Sep-2003Performance evaluation of pure CBN tools for machining of steelNeo, K.S. ; Rahman, M. ; Li, X.P. ; Khoo, H.H.; Sawa, M.; Maeda, Y.