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Cui Cheng Qiang

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Full Name
Cui Cheng Qiang
Variants
CUI, CHENG QIANG
Cui, C.Q.
CUI, CHENG Q.
 
Main Affiliation
 
Faculty
 

Publications

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Department:  INSTITUTE OF MICROELECTRONICS

Results 1-16 of 16 (Search time: 0.007 seconds).

Issue DateTitleAuthor(s)
121-Feb-1996Electrochemical copolymerization of aniline and metanilic acidLee, J.Y. ; Cui, C.Q. 
22000Grafting of epoxy resin on surface-modified poly(tetrafluoroethylene) filmsYu, Z.J.; Kang, E.T. ; Neoh, K.G. ; Cui, C.Q. ; Lim, T.B.
32000Grafting of epoxy resin on surface-modified poly(tetrafluoroethylene) filmsYu, Z.J.; Kang, E.T. ; Neoh, K.G. ; Cui, C.Q. ; Lim, T.B.
4Jan-2000Low-temperature graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils - Effect of crosslinking agentsAng, A.K.S.; Kang, E.T. ; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Lim, T.B. 
51998Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foilsAng, A.K.S.; Kang, E.T. ; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Lim, T.B. 
612-Sep-1996Metal-polymer interactions in the Ag+|poly-o-aminophenol systemZhang, A.Q.; Cui, C.Q. ; Lee, J.Y. 
71-Apr-2003Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrateZHANG, JUNFENG ; CUI, CHENG QIANG ; LIM, THIAM BENG ; KANG, EN-TANG 
81-Jan-2002Method for low temperature lamination of metals to fluoropolymersKANG, EN TANG ; SHI, JIAN-LI ; NEOH, KOON GEE ; TAN, KUANG LEE ; CUI, CHENG QIANG ; LIM, THIAM BENG 
925-Mar-2003Method for low temperature lamination of metals to polyimidesKANG, EN-TANG ; ANG, ARTHUR KHOON SIAH; NEOH, KOON GEE ; CUI, CHENG QIANG ; LIM, THIAM BENG 
10Nov-1996Modification of substrate surface for BGA overmold adhesion enhancement by graft copolymerizationWang, T.; Kang, E.T. ; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Chakravorty, K.K.; Lim, T.B. 
111997Numerical simulation of the flip-chip underfilling processTay, A.A.O. ; Huang, Z.M. ; Wu, J.H. ; Cui, C.Q. 
12Oct-2001Plasma polymerization and deposition of glycidyl methacrylate on Si(100) surface for adhesion improvement with polyimideZou, X.P.; Kang, E.T. ; Neoh, K.G.; Zhang, Y. ; Tan, K.L. ; Cui, C.Q. ; Lim, T.B.
131999Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copperLiu, Y.X.; Kang, E.T. ; Neoh, K.G. ; Zhang, J.F.; Cui, C.Q. ; Lim, T.B. 
141999Surface graft copolymerization of poly(tetrafluoroethylene) film with simultaneous lamination to copper foilKang, E.T. ; Liu, Y.X.; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Lim, T.B. 
15Dec-2001Surface modification of poly(tetrafluoroethylene) films by plasma pre-activation and plasma polymerization of glycidyl methacrylateZou, X.P.; Kang, E.T. ; Neoh, K.G. ; Cui, C.Q. ; Lim, T.B. 
161997Surface structures and adhesion enhancement of poly(tetrafluoroethylene) films after modification by graft copolymerization with glycidyl methacrylateWang, T.; Kang, E.T. ; Neoh, K.G. ; Tan, K.L. ; Cui, C.Q. ; Lim, T.B.