Chengkuo Lee

Collaboration Map View Statistics Email Alert RSS Feed

Full Name

Chengkuo Lee

Variants

Lee, C.-K.
Lee Chengkuo
Chengkuo, L.
Lee, C.
Lee, C.K.
Lee Chengkun
Lee Cheng Kuo
Lee, Vincent Ch
Vincent Lee

Main Affiliation

ELECTRICAL AND COMPUTER ENGINEERING
COLLEGE OF DESIGN AND ENGINEERING

Faculty

FAC OF ENGINEERING
COLLEGE OF DESIGN & ENG

elelc@nus.edu.sg

Refined By:

Author: Lau, J.H.

Subject: Indium

Results 1-3 of 3 (Search time: 0.004 seconds).

Refman EndNote Bibtex RefWorks Excel CSV PDF Send via email

	Issue Date	Title	Author(s)
1	31-Aug-2009	Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packaging	Lee, C. ; Yu, A.; Yan, L.; Wang, H.; He, J.H.; Zhang, Q.X.; Lau, J.H.
2	2008	Development of wafer level packaged scanning micromirrors	Yu, A.; Lee, C. ; Yan, L.L.; Zhang, Q.X.; Yoon, S.U.; Lau, J.H.
3	Feb-2009	Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications	Made, R.I.; Gan, C.L.; Yan, L.L.; Yu, A.; Yoon, S.W.; Lau, J.H.; Lee, C.