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|Title:||High-temperature properties of a low dielectric constant organic spin-on glass for multilevel interconnects|
Low dielectric material
|Citation:||Wang, C.Y., Shen, Z.X., Zheng, J.Z. (2001-10). High-temperature properties of a low dielectric constant organic spin-on glass for multilevel interconnects. Applied Spectroscopy 55 (10) : 1347-1351. ScholarBank@NUS Repository. https://doi.org/10.1366/0003702011953469|
|Abstract:||In this paper, we report on the thermal properties of a low-dielectric-constant organic spin-on glass, methyl silsesquioxane (MSQ), an important material for semiconductor device fabrication. The compositional and structural changes of this MSQ material, when heated in air and N2, were investigated in detail with Fourier transform infrared (FT-IR) spectroscopy and thermogravimetric analysis (TGA). MSQ transforms to thermal oxide SiO2 above 500°C when heated in air, and it forms oxygen-deficient SiO2 above 700 °C in N2. Our results suggest that a cure temperature higher than the current 425°C is preferred to form films with better cross-linked network structure.|
|Source Title:||Applied Spectroscopy|
|Appears in Collections:||Staff Publications|
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