Please use this identifier to cite or link to this item: https://doi.org/10.1016/S0169-4332(02)00473-7
Title: Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine
Authors: Wang, W.C.
Kang, E.T. 
Neoh, K.G. 
Keywords: 4-Vinylpyridine
Adhesion
Copper
Electroless plating
Plasma polymerization
Polyimide
Issue Date: 30-Oct-2002
Source: Wang, W.C.,Kang, E.T.,Neoh, K.G. (2002-10-30). Electroless plating of copper on polyimide films modified by plasma graft copolymerization with 4-vinylpyridine. Applied Surface Science 199 (1-4) : 52-56. ScholarBank@NUS Repository. https://doi.org/10.1016/S0169-4332(02)00473-7
Abstract: Surface modification of argon plasma-pretreated polyimide (PI, Kapton® HN) films by plasma graft copolymerization with 4-vinylpyridine (4VP) was carried out. The effects of glow discharge conditions on the chemical composition and structure of the plasma-polymerized 4VP (pp-4VP) films were analyzed by X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared (FTIR) spectroscopy, respectively. The XPS and FTIR results revealed that the pyridine groups in the pp-4VP layer could be preserved to a large extent under proper glow discharge condition. The topography of the modified PI surface was investigated by atomic force microscopy (AFM). The pp-4VP film with well-preserved pyridine groups was used not only as the chemisorption sites for the palladium complexes (without the need for prior sensitization by SnCl2) during the electroless plating of copper, but also as an adhesion promotion layer to enhance the adhesion of the electrolessly deposited copper with the PI film. The T-peel adhesion strength of the electrolessly deposited copper to the pp-4VP grafted PI (pp-4VP-PI) film could reach about 7N/cm. This adhesion strength was much higher than that of the electrolessly deposited copper to the pristine or the Ar plasma-treated PI film. © 2002 Elsevier Science B.V. All rights reserved.
Source Title: Applied Surface Science
URI: http://scholarbank.nus.edu.sg/handle/10635/91965
ISSN: 01694332
DOI: 10.1016/S0169-4332(02)00473-7
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