Please use this identifier to cite or link to this item: https://doi.org/10.1116/1.1388620
Title: Electroless plating of copper on poly(tetrafluoroethylene) films modified by NH3 plasma and surface graft copolymerization with aniline
Authors: Ma, Z.H.
Tan, K.L. 
Alian, A.D.
Kang, E.T. 
Neoh, K.G. 
Issue Date: Sep-2001
Citation: Ma, Z.H., Tan, K.L., Alian, A.D., Kang, E.T., Neoh, K.G. (2001-09). Electroless plating of copper on poly(tetrafluoroethylene) films modified by NH3 plasma and surface graft copolymerization with aniline. Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films 19 (5) : 2471-2478. ScholarBank@NUS Repository. https://doi.org/10.1116/1.1388620
Abstract: The electroless plating of copper on Poly(tetrafluoroethylene) (PTFE) films modified by ammonia plasma and surface graft copolymerization with aniline was reported. The each stage of surface modification, surface activation and electroless deposition processes were investigated to study the composition and chemical states of the PTFE using x-ray photoelectron spectroscopy (XPS). The adhesion strength was found to be dependent on the graft concentration, and it was due to the synergistic effects of strong interaction between the grafted aniline polymer and the metal atoms including the spatial distribution of metal matrix and the covalent tether of graft chains on the PTFE surface.
Source Title: Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films
URI: http://scholarbank.nus.edu.sg/handle/10635/91963
ISSN: 07342101
DOI: 10.1116/1.1388620
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