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|Title:||Mechanical properties of Cu-Al-O thin films prepared by plasma-enhanced chemical vapor deposition|
|Citation:||Chen, W., Gong, H., Zeng, K. (2006). Mechanical properties of Cu-Al-O thin films prepared by plasma-enhanced chemical vapor deposition. Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films 24 (3) : 537-541. ScholarBank@NUS Repository. https://doi.org/10.1116/1.2191860|
|Abstract:||Copper aluminum oxide thin films were prepared by the plasma-enhanced chemical vapor deposition from metal organic precursors. The film was characterized by x-ray diffraction, atomic force microscopy, and the depth profile analysis using secondary ion mass spectrometry. Nanoindentation was performed to measure the hardness and elastic modulus of the film. The mechanical strengthening of the film was considered to be due to nanograins of CuAl O2 and CuO throughout the film, the large area of grain boundaries, and also finer Al2 O3 particles dispersed in the film matrix. © 2006 American Vacuum Society.|
|Source Title:||Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films|
|Appears in Collections:||Staff Publications|
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