Please use this identifier to cite or link to this item: https://doi.org/10.1115/IMECE2007-41762
Title: Influence of reinforcements on the electrical resistivity of novel Sn-Ag-Cu composite solder
Authors: Nai, S.M.L.
Wei, J.
Gupta, M. 
Issue Date: 2008
Source: Nai, S.M.L.,Wei, J.,Gupta, M. (2008). Influence of reinforcements on the electrical resistivity of novel Sn-Ag-Cu composite solder. ASME International Mechanical Engineering Congress and Exposition, Proceedings 5 : 39-42. ScholarBank@NUS Repository. https://doi.org/10.1115/IMECE2007-41762
Abstract: In the present study, 2 different composite solder systems were successfully synthesized using powder metallurgy route consisting of: blending, compaction, sintering and extrusion. The Sn-Ag-Cu based composite solders were reinforced with namely, titanium diboride (TiB2) particulates and multi-walled carbon nanotubes (MWCNTs). The extruded materials were then characterized for their electrical resistivity values using the four-point probe setup from Jandel. The electrical resistivity results showed no degradation of electrical performance of the composite solders, except at high volume percentages of TiB2 addition. This signified that with judicious selection of the reinforcement type and the amount of reinforcement addition, these advanced interconnect materials will benefit industries like the microelectronics flip chip assembly and packaging, MEMS systems and NEMS systems. Copyright © 2007 by ASME.
Source Title: ASME International Mechanical Engineering Congress and Exposition, Proceedings
URI: http://scholarbank.nus.edu.sg/handle/10635/85995
ISBN: 0791842991
DOI: 10.1115/IMECE2007-41762
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