Please use this identifier to cite or link to this item: https://doi.org/10.1109/EPTC.2009.5416539
Title: Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders
Authors: Chandra Rao, B.S.S.
Mohan Kumar, K.
Zeng, K.Y. 
Tay, A.A.O. 
Kripesh, V.
Keywords: Lead-free composite solders
Strain hardening exponent
Strain rate
Issue Date: 2009
Citation: Chandra Rao, B.S.S., Mohan Kumar, K., Zeng, K.Y., Tay, A.A.O., Kripesh, V. (2009). Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders. Proceedings of the Electronic Packaging Technology Conference, EPTC : 272-277. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2009.5416539
Abstract: The tensile flow behavior of Sn-3.8Ag-0.7Cu (SAC387) nanocomposite solders have been studied with strain rates ranging from 10-5 to 10 -1s-1 and at temperature of 25, 75 and 125° C. The flow stress and the Hollomon parameters were observed to increase substantially with increasing strain rate. The strain hardening exponent increased substantially with increasing strain rate and decreasing with temperature for all the composite solders investigated. The strain rate dependence of strain hardening exponent was stronger at higher temperatures for SAC387 solder alloy, while it is weaker for composite solders reinforced with nano sized Mo particles. The strain hardening exponent was found to be less sensitive to temperature at higher strain rates. The fractographic features of ambient and elevated temperature tensile fracture surfaces of the nanocomposite solders deformed at various strain rates are discussed. ©2009 IEEE.
Source Title: Proceedings of the Electronic Packaging Technology Conference, EPTC
URI: http://scholarbank.nus.edu.sg/handle/10635/85944
ISBN: 9781424451005
DOI: 10.1109/EPTC.2009.5416539
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

6
checked on Jul 14, 2018

WEB OF SCIENCETM
Citations

1
checked on Jul 4, 2018

Page view(s)

12
checked on Apr 20, 2018

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.