Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/85865
Title: A study on the mechanical behavior of the sputtered nickel thin Films for UBM applications
Authors: Sekhar, V.N.
Srinivasarao, V.
Jayaganthan, R. 
Mohankumar, K.
Tay, A.A.O. 
Issue Date: 2004
Source: Sekhar, V.N.,Srinivasarao, V.,Jayaganthan, R.,Mohankumar, K.,Tay, A.A.O. (2004). A study on the mechanical behavior of the sputtered nickel thin Films for UBM applications. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 610-614. ScholarBank@NUS Repository.
Abstract: Nickel films of different thicknesses of 0.5 and 0.8 μm were deposited by DC magnetron sputtering on the adhesion promoting Ta layer deposited on the Silicon (100) wafer. The sputtering conditions used were 4 × 10 -6 base pressure; 3 × 10-1 working pressure; 4 kW sputter power for 8 inch targets. The films were annealed in vacuum at temperature 200°C and their elastic modulus and hardness were measured by Nanoindentation Technique (Hysitron Triboscope). Different load rates were used when indenting the samples. The influence of thickness and annealing temperature on the mechanical behaviour of Nickel thin films is explored in the present work. © 2004 IEEE.
Source Title: Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
URI: http://scholarbank.nus.edu.sg/handle/10635/85865
ISBN: 0780388216
Appears in Collections:Staff Publications

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