Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.applthermaleng.2011.02.007
Title: Numerical investigation of transfer coefficients of an evaporatively-cooled condenser
Authors: Jahangeer, K.A. 
Tay, A.A.O. 
Raisul Islam, M.
Keywords: Condensing temperature
Evaporatively-cooled condenser
Finite difference technique
Heat transfer coefficients
Water film thickness
Issue Date: Jul-2011
Source: Jahangeer, K.A., Tay, A.A.O., Raisul Islam, M. (2011-07). Numerical investigation of transfer coefficients of an evaporatively-cooled condenser. Applied Thermal Engineering 31 (10) : 1655-1663. ScholarBank@NUS Repository. https://doi.org/10.1016/j.applthermaleng.2011.02.007
Abstract: Vapour compression cooling systems working in tropical climatic conditions make the compressor pressure-lift relatively high. The lowering of the condensing temperature will help reduce this lift, thereby reducing the power required by the compressor. The inclusion of water sprays or droplets in air-cooled condensers is a possible option for improving the performance of the condenser by reducing the temperature lift. This paper reports a numerical investigation of the heat transfer characteristics of an evaporatively-cooled condenser. A detailed model is developed and numerical simulations are carried out using finite difference techniques. The simulations are performed for a single unfinned tube of the condenser with the air flowing across the tube. Water is sprayed on top of the tube in the form of fine sprays and the flow rate is set to achieve film thicknesses of 0.075, 0.1, and 0.15 mm, respectively. The tube wall temperature is assumed constant due to the fact that for most of the tube length, condensation of the refrigerant occurs at the saturation temperature of the refrigerant. Wall to air overall heat transfer coefficient (U) value as high as 2000 W/m2 K is observed with the incorporation of the evaporative cooling. The numerical results are compared with available experimental and theoretical work and the agreement is found to be satisfactory. © 2011 Elsevier Ltd. All rights reserved.
Source Title: Applied Thermal Engineering
URI: http://scholarbank.nus.edu.sg/handle/10635/85499
ISSN: 13594311
DOI: 10.1016/j.applthermaleng.2011.02.007
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

25
checked on Mar 5, 2018

WEB OF SCIENCETM
Citations

17
checked on Mar 5, 2018

Page view(s)

43
checked on Feb 25, 2018

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.