High strength lead-free composite solder materials using Nano-Al 2O3 as reinforcement

Abstract

The characteristics of lead-free composite solder materials reinforced with nano size alumina particles, synthesized using powder metallurgy technique, were discussed. The microstructural characterization studies revealed fairly uniform distribution of nanosize reinforcement particles in solder matrix. Uniform distribution of intermetallics and good interfacial integrity between secondary phases and matrix can be attributed as contributing factors that assisted in increasing strength of composite formulation. The results revealed that enhanced properties can be achieved by selection and incorporation of nanosized alumina particulates as reinforcements in lead free solder.