Enhancing the mechanical response of a lead-free solder using an energy-efficient microwave sintering route

Please use this identifier to cite or link to this item: https://doi.org/10.1007/s11664-008-0399-2

Title:	Enhancing the mechanical response of a lead-free solder using an energy-efficient microwave sintering route
Authors:	Babaghorbani, P. Gupta, M.
Keywords:	Densification Lead-free solder Microwave sintering Tensile properties
Issue Date:	Jun-2008
Citation:	Babaghorbani, P., Gupta, M. (2008-06). Enhancing the mechanical response of a lead-free solder using an energy-efficient microwave sintering route. Journal of Electronic Materials 37 (6) : 860-866. ScholarBank@NUS Repository. https://doi.org/10.1007/s11664-008-0399-2
Abstract:	This study compares the effects of conventional and microwave sintering on the densification, microstructure, and tensile properties of a lead-free solder, Sn-3.5Ag. Conventional sintering was carried out in an inert atmosphere while microwave sintering was performed under ambient conditions. Microstructural characterization was carried out to investigate characteristics of grains, pores, and Ag 3Sn intermetallic compounds. Tensile characterization studies revealed that 0.2% yield strength, ultimate tensile strength, and work of fracture were significantly increased by using microwave sintering. © 2008 TMS.
Source Title:	Journal of Electronic Materials
URI:	http://scholarbank.nus.edu.sg/handle/10635/85158
ISSN:	03615235
DOI:	10.1007/s11664-008-0399-2
Appears in Collections:	Staff Publications

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