Please use this identifier to cite or link to this item: https://doi.org/10.1007/s11664-008-0399-2
Title: Enhancing the mechanical response of a lead-free solder using an energy-efficient microwave sintering route
Authors: Babaghorbani, P.
Gupta, M. 
Keywords: Densification
Lead-free solder
Microwave sintering
Tensile properties
Issue Date: Jun-2008
Source: Babaghorbani, P., Gupta, M. (2008-06). Enhancing the mechanical response of a lead-free solder using an energy-efficient microwave sintering route. Journal of Electronic Materials 37 (6) : 860-866. ScholarBank@NUS Repository. https://doi.org/10.1007/s11664-008-0399-2
Abstract: This study compares the effects of conventional and microwave sintering on the densification, microstructure, and tensile properties of a lead-free solder, Sn-3.5Ag. Conventional sintering was carried out in an inert atmosphere while microwave sintering was performed under ambient conditions. Microstructural characterization was carried out to investigate characteristics of grains, pores, and Ag 3Sn intermetallic compounds. Tensile characterization studies revealed that 0.2% yield strength, ultimate tensile strength, and work of fracture were significantly increased by using microwave sintering. © 2008 TMS.
Source Title: Journal of Electronic Materials
URI: http://scholarbank.nus.edu.sg/handle/10635/85158
ISSN: 03615235
DOI: 10.1007/s11664-008-0399-2
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

13
checked on Mar 7, 2018

WEB OF SCIENCETM
Citations

10
checked on Nov 22, 2017

Page view(s)

36
checked on Apr 20, 2018

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.