Process-induced strained P-MOSFET featuring nickel-platinum silicided source/drain

Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/84113

Title:	Process-induced strained P-MOSFET featuring nickel-platinum silicided source/drain
Authors:	Lee, R.T.P. Liow, T.-Y. Tan, K.-M. Ang, K.-W. Chui, K.-J. Guo, Q.-L. Samudra, G. Chi, D.-Z. Yeo, Y.-C.
Issue Date:	2006
Citation:	Lee, R.T.P.,Liow, T.-Y.,Tan, K.-M.,Ang, K.-W.,Chui, K.-J.,Guo, Q.-L.,Samudra, G.,Chi, D.-Z.,Yeo, Y.-C. (2006). Process-induced strained P-MOSFET featuring nickel-platinum silicided source/drain. Materials Research Society Symposium Proceedings 913 : 59-64. ScholarBank@NUS Repository.
Abstract:	We report the use of nickel-platinum suicide (NiPtSi) as a source/drain (S/D) material for strain engineering in P-MOSFETs to improve drive current performance. The material and electrical characteristics of NiPtSi with various Pt concentrations was investigated and compared with those of NiSi. Ni 0.95Pt0.05Si was selected for device integration. A 0.18 μm gate length P-MOSFET achieved a 22% gain in IDsat, when Ni 0.95Pt0.05Si S/D is employed instead of NiSi S/D. The enhancement is attributed to strain modification effects related to the nickel-platinum silicidation process. © 2006 Materials Research Society.
Source Title:	Materials Research Society Symposium Proceedings
URI:	http://scholarbank.nus.edu.sg/handle/10635/84113
ISBN:	1558998691
ISSN:	02729172
Appears in Collections:	Staff Publications

There are no files associated with this item.

Check