Please use this identifier to cite or link to this item:
|Title:||Work-function tuning of TaN by high-temperature metal intermixing technique for gate-first CMOS process|
Dual work function (WF)
|Source:||Ren, C., Chan, D.S.H., Loh, W.Y., Balakumar, S., Du, A.Y., Tung, C.H., Lo, G.Q., Kumar, R., Balasubramanian, N., Kwong, D.-L. (2006). Work-function tuning of TaN by high-temperature metal intermixing technique for gate-first CMOS process. IEEE Electron Device Letters 27 (10) : 811-813. ScholarBank@NUS Repository. https://doi.org/10.1109/LED.2006.882569|
|Abstract:||This letter investigates the feasibility of adjusting the work function (WF) of TaN metal gate by intermixing (InM) of ultra-thin TaN/Metal stacks at high temperature. This could be useful for the integration of dual-WF metal gates in a gate-first CMOS process without exposing gate dielectric during metal-etching process. TaN/Tb and TaN/Ir stacks were studied, and it is found that the WF of TaN can be readily modulated through metal InM in TaN/Tb stack after high-temperature treatment (∼1000°C), which simulates the source/drain dopant activation process in a gate-first CMOS process. Factors affecting the InM process will be discussed. Successful transistor threshold voltage adjustment by ∼300 mV on high-kappa HfTaON/HfO2 dielectrics has also been demonstrated in TaN/Tb stack using this technique. © 2006 IEEE.|
|Source Title:||IEEE Electron Device Letters|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Mar 6, 2018
WEB OF SCIENCETM
checked on Jan 24, 2018
checked on Mar 11, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.