Please use this identifier to cite or link to this item: https://doi.org/10.1116/1.1507339
Title: Thermal reaction of nickel and Si0.75Ge0.25 alloy
Authors: Pey, K.L. 
Choi, W.K. 
Chattopadhyay, S.
Zhao, H.B.
Fitzgerald, E.A.
Antoniadis, D.A.
Lee, P.S.
Issue Date: Nov-2002
Source: Pey, K.L., Choi, W.K., Chattopadhyay, S., Zhao, H.B., Fitzgerald, E.A., Antoniadis, D.A., Lee, P.S. (2002-11). Thermal reaction of nickel and Si0.75Ge0.25 alloy. Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films 20 (6) : 1903-1910. ScholarBank@NUS Repository. https://doi.org/10.1116/1.1507339
Abstract: Thermal reactions of nickel and Si0.75Ge0.25 alloy were investigated. The silicided films were characterized by X-ray diffraction, Auger electron spectroscopy, scanning electron microscopy, transmission electron microscopy, and micro-Raman microscopy techniques. It was found that the sheet resistance of the silicided films increased abruptly for annealing temperature above 800°C.
Source Title: Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
URI: http://scholarbank.nus.edu.sg/handle/10635/83191
ISSN: 07342101
DOI: 10.1116/1.1507339
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