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https://doi.org/10.1088/0953-8984/14/8/301
Title: | Thermal decomposition kinetics of amorphous carbon nitride and carbon films | Authors: | Zhang, L.H. Gong, H. Wang, J.P. |
Issue Date: | 4-Mar-2002 | Citation: | Zhang, L.H., Gong, H., Wang, J.P. (2002-03-04). Thermal decomposition kinetics of amorphous carbon nitride and carbon films. Journal of Physics Condensed Matter 14 (8) : 1697-1708. ScholarBank@NUS Repository. https://doi.org/10.1088/0953-8984/14/8/301 | Abstract: | Kinetic thermal degradation of amorphous carbon and carbon nitride films is studied. Significantly improved thermal stability was observed for films intensified with C-N, C=N, and C≡N bonds. When the N2% (percentage of nitrogen) in Ar/N2 during film deposition was varied from 0 to 30 at pressures of 3 × 10-3 and 16 × 10-3 Torr, the onset decomposition temperatures increased from 396 to 538 and from 340 to 360 °C, while the apparent activation energy ΔE at 60% residual weight increased from 149 to 158 and from 96 to 120 kJ mol-1, respectively. A change in the thermal stability was observed when the N2% reached 50. The films of higher bonding ratio and structural integration showed a single-step decomposition mechanism. They had ΔE values decreasing with the decomposition process, following convex-trend isothermal weight-loss curves. Films deposited using low-energy carbon plasma had higher contents of loosely bonded molecules; this resulted in a seemingly two-step decomposition and ΔE increasing with weight loss over a certain range. They followed concave-trend isothermal weight-loss curves. The overall decomposition mechanism could best be expressed in terms of nth-order reactions with the value of n closely related to film structures and reaction temperatures. Lower n-values are related to densely packed structure and higher temperature due to the increased diffusion barrier of the products. | Source Title: | Journal of Physics Condensed Matter | URI: | http://scholarbank.nus.edu.sg/handle/10635/83189 | ISSN: | 09538984 | DOI: | 10.1088/0953-8984/14/8/301 |
Appears in Collections: | Staff Publications |
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