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|Title:||Raman spectroscopy investigation on excimer laser annealing and thickness determination of nanoscale amorphous silicon|
|Source:||Zeng, Y.P.,Lu, Y.F.,Shen, Z.X.,Sun, W.X.,Yu, T.,Liu, L.,Zeng, J.N.,Cho, B.J.,Poon, C.H. (2004-05). Raman spectroscopy investigation on excimer laser annealing and thickness determination of nanoscale amorphous silicon. Nanotechnology 15 (5) : 658-662. ScholarBank@NUS Repository. https://doi.org/5/043|
|Abstract:||Raman spectroscopy was used to investigate excimer laser annealing and thickness determination of amorphous silicon (a-Si) layers which are less than 20 nm thick. The a-Si layers were produced on silicon (Si) substrates using Si+ ion implantation with an energy of 10 keV and a dose of 1 × 1015 cm-2. Excimer laser annealing was applied to re-crystallize the a-Si layers. The dependence of re-crystallization on laser fluence was investigated using Raman spectroscopy. A threshold laser fluence of 0.4 J cm-2 was required to re-crystallize the a-Si layers. In Raman spectroscopy, the Raman intensity shows a periodical variation with a period of 90° as a function of the angle between the Si orientation and the laser polarization. Based on this phenomenon, a method to determine nanoscale a-Si film thickness was proposed in two ways. One way was carried out without sample rotation to determine the a-Si thickness provided that the reference c-Si and a-Si/c-Si samples are in the same crystal orientation. The other way was carried out with sample rotation to determine the a-Si thickness without knowing the crystal orientation beforehand.|
|Appears in Collections:||Staff Publications|
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