Please use this identifier to cite or link to this item: https://doi.org/10.1109/LAWP.2009.2039031
Title: Integration of grid array antenna in chip package for highly integrated 60-GHz radios
Authors: Sun, M.
Zhang, Y.P.
Guo, Y.X. 
Chua, K.M.
Wai, L.L.
Keywords: 60-GHz radio
Grid array antenna
Grid array package
Low-temperature cofired ceramic (LTCC)
Issue Date: 2009
Citation: Sun, M.,Zhang, Y.P.,Guo, Y.X.,Chua, K.M.,Wai, L.L. (2009). Integration of grid array antenna in chip package for highly integrated 60-GHz radios. IEEE Antennas and Wireless Propagation Letters 8 : 1364-1366. ScholarBank@NUS Repository. https://doi.org/10.1109/LAWP.2009.2039031
Abstract: A grid array antenna integrated in a thin cavity-down eramic ball grid array (CBGA) package in low-temperature ofired ceramic (LTCC) technology is reported. The grid array ntenna, intended for use in highly integrated 60-GHz radios, as achieved good matching (|S11|≤-10 dB) and directional patterns from 57 to 64 GHz as well as high gain with the peak value of 13.5 dBi at 60 GHz. © 2010 IEEE.
Source Title: IEEE Antennas and Wireless Propagation Letters
URI: http://scholarbank.nus.edu.sg/handle/10635/82549
ISSN: 15361225
DOI: 10.1109/LAWP.2009.2039031
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