Please use this identifier to cite or link to this item:
https://doi.org/10.1109/LAWP.2009.2039031
| Title: | Integration of grid array antenna in chip package for highly integrated 60-GHz radios | Authors: | Sun, M. Zhang, Y.P. Guo, Y.X. Chua, K.M. Wai, L.L. |
Keywords: | 60-GHz radio Grid array antenna Grid array package Low-temperature cofired ceramic (LTCC) |
Issue Date: | 2009 | Citation: | Sun, M.,Zhang, Y.P.,Guo, Y.X.,Chua, K.M.,Wai, L.L. (2009). Integration of grid array antenna in chip package for highly integrated 60-GHz radios. IEEE Antennas and Wireless Propagation Letters 8 : 1364-1366. ScholarBank@NUS Repository. https://doi.org/10.1109/LAWP.2009.2039031 | Abstract: | A grid array antenna integrated in a thin cavity-down eramic ball grid array (CBGA) package in low-temperature ofired ceramic (LTCC) technology is reported. The grid array ntenna, intended for use in highly integrated 60-GHz radios, as achieved good matching (|S11|≤-10 dB) and directional patterns from 57 to 64 GHz as well as high gain with the peak value of 13.5 dBi at 60 GHz. © 2010 IEEE. | Source Title: | IEEE Antennas and Wireless Propagation Letters | URI: | http://scholarbank.nus.edu.sg/handle/10635/82549 | ISSN: | 15361225 | DOI: | 10.1109/LAWP.2009.2039031 |
| Appears in Collections: | Staff Publications |
Show full item record
Files in This Item:
There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.