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|Title:||Germanium nanowire metal-oxide-semiconductor field-effect transistor fabricated by complementary-metal-oxide-semiconductor-compatible process|
metaloxidesemiconductor field-effect transistor (MOSFET)
|Citation:||Peng, J.W., Singh, N., Lo, G.Q., Bosman, M., Ng, C.M., Lee, S.J. (2011-01). Germanium nanowire metal-oxide-semiconductor field-effect transistor fabricated by complementary-metal-oxide-semiconductor-compatible process. IEEE Transactions on Electron Devices 58 (1) : 74-79. ScholarBank@NUS Repository. https://doi.org/10.1109/TED.2010.2088125|
|Abstract:||This work presents a complementary metaloxidesemiconductor-compatible topdown fabrication of Ge nanowires along with their integration into pMOSFETs with "HfO2/TaN" high-k/metal gate stacks. Lateral Ge wires down to 14 nm in diameter are achieved using a two-step dry etch process on a high-quality epitaxial Ge layer. To improve the interface quality between the Ge nanowire and the HfO2, thermally grown GeO2 and epitaxial-Si shells are used as interlayers. Devices with a GeO2 shell demonstrated excellent ION/I OFF} ratios (>106), whereas the epitaxial-Si shell was found to improve the field-effect mobility of the holes in Ge nanowires to 254 cm2V -1.s-1. © 2010 IEEE.|
|Source Title:||IEEE Transactions on Electron Devices|
|Appears in Collections:||Staff Publications|
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