Please use this identifier to cite or link to this item: https://doi.org/10.1109/TCPMT.2013.2285388
Title: Electric coupling structure of substrate integrated waveguide (SIW) for the application of 140-GHz bandpass filter on LTCC
Authors: Wong, S.W.
Wang, K.
Chen, Z.-N. 
Chu, Q.-X.
Keywords: 140 GHz
bandpass filter (BPF)
electromagnetic bandgap (EBG)
low temperature co-fired ceramic (LTCC)
millimeter-wave (mmW)
substrate integrated waveguide (SIW)
Issue Date: Feb-2014
Citation: Wong, S.W., Wang, K., Chen, Z.-N., Chu, Q.-X. (2014-02). Electric coupling structure of substrate integrated waveguide (SIW) for the application of 140-GHz bandpass filter on LTCC. IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (2) : 316-322. ScholarBank@NUS Repository. https://doi.org/10.1109/TCPMT.2013.2285388
Abstract: Millimeter-wave (mmW) bandpass filters (BPFs) using substrate integrated waveguide (SIW) are proposed in this paper. The propagation constants of two different types of electromagnetic bandgap (EBG) units are discussed and compared for their passbands and stopbands performance. In among, the slotted-SIW unit shows a very good lower and upper-stopband performance. The mmW BPF with three cascaded uniform slotted-SIW-based EBG units is constructed and designed at 40-GHz. This EBG filter exhibits good out-of-band performance. To further improve the in-band performance, a third-order mmW BPF with nonuniformly cascaded slotted-SIW unit is designed at 140 GHz. The filter is investigated with the theory of electric coupling mechanism. The extracted coupling coefficient $(K)$ and quality factor $(Q)$ are used to determine the filter circuit dimensions. To prove the validity, the two proposed structures are fabricated in a single-circuit layer using low temperature co-fired ceramic technology and measured at 40 and 140 GHz, respectively. The measured results are in good agreement with the simulated results in such high frequency. The measured insertion losses at 40 GHz and 140 GHz are 0.72 and 1.913 dB, respectively. © 2013 IEEE.
Source Title: IEEE Transactions on Components, Packaging and Manufacturing Technology
URI: http://scholarbank.nus.edu.sg/handle/10635/82244
ISSN: 21563950
DOI: 10.1109/TCPMT.2013.2285388
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