Please use this identifier to cite or link to this item: https://doi.org/10.1063/1.1374234
Title: Dewetting of resist/metal bilayers in resist stripping processes
Authors: Wu, Y. 
Qiao, P.
Chong, T. 
Low, T.-S. 
Xie, H.
Luo, P.
Guo, Z.
Qiu, J.
Issue Date: 21-May-2001
Citation: Wu, Y., Qiao, P., Chong, T., Low, T.-S., Xie, H., Luo, P., Guo, Z., Qiu, J. (2001-05-21). Dewetting of resist/metal bilayers in resist stripping processes. Applied Physics Letters 78 (21) : 3361-3363. ScholarBank@NUS Repository. https://doi.org/10.1063/1.1374234
Abstract: We report the observations of dewetting of resist/metal bilayers in a resist stripping process of nanofabrication in O2 plasma. The initiation of the dewetting process is tentatively associated with local heating caused by surface plasmon induced in metallic nanoparticles or nanowires. The surface patterns thus formed differ substantially from all the dewetting patterns reported so far, and they resemble trees at micrometer scale. The possible mechanism for the formation of this kind striking patterns is discussed and its implication to future nanoelectronics manufacturing is addressed. © 2001 American Institute of Physics.
Source Title: Applied Physics Letters
URI: http://scholarbank.nus.edu.sg/handle/10635/82151
ISSN: 00036951
DOI: 10.1063/1.1374234
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