Please use this identifier to cite or link to this item: https://doi.org/10.1117/12.280547
Title: Effect of argon or nitrogen pre-amorphized implant on SALICIDE formation for deep sub-micron CMOS technology
Authors: Ho, C.S.
Pey, K.L.
Wong, H.
Karunasirf, R.P.G. 
Chua, S.J. 
Lee, K.H.
Tang, Y.
Wong, S.M.
Chan, L.H.
Keywords: Amorphization
Amorphous silicon
Argon
Arsenic
CMOS technology
Junction leakage
Nitrogen
SALICIDE
Sheet resistivity
Titanium silicide
Issue Date: 1997
Source: Ho, C.S., Pey, K.L., Wong, H., Karunasirf, R.P.G., Chua, S.J., Lee, K.H., Tang, Y., Wong, S.M., Chan, L.H. (1997). Effect of argon or nitrogen pre-amorphized implant on SALICIDE formation for deep sub-micron CMOS technology. Proceedings of SPIE - The International Society for Optical Engineering 3183 : 243-254. ScholarBank@NUS Repository. https://doi.org/10.1117/12.280547
Abstract: A Ti-SALICIDE process incorporating an argon or nitrogen-amorphization implantation prior to silicidation to enhance the C54-TiSi2 formation for deep submicron CMOS devices is presented. It was found that by incorporating a high-temperature titanium deposition at 400 °C together with argon-amorphization at a dosage of 3X1014 cm-2 to 6X1014 cm-2, excellent sheet p was obtained for gate lengths down to 0.25 μm. The improvement seen using a lower temperature (100°C) deposition was relatively less. We postulate that the higher deposition temperature ensures that the C54 phase is nucleated before the C49 phase forms large grains. No noticeable difference was observed for dosages ranging between 3X1014 cm-2 and 6X1014 cm"-2for the argon implant. In the case for nitrogen- amorphization, the improvement seen on the narrow polyS/ gate was also promising. The impact of dopants on silicidation was evaluated and discussed. Drawbacks of this technique appear to manifest in the compromised integrity of the source/drain junctions, and higher gate-to-source drain leakages, as evident in the case of argon and nitrogen amorphization implants. The anomalous leakage behaviour observed for both argon and nitrogen was however not evident in the case of the arsenic implant. Comparable performance to the SALICIDE process with no pre-amorphization with respect to the leakage parameters was achieved for the arsenic-amorphized wafers.
Source Title: Proceedings of SPIE - The International Society for Optical Engineering
URI: http://scholarbank.nus.edu.sg/handle/10635/81402
ISSN: 0277786X
DOI: 10.1117/12.280547
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