Please use this identifier to cite or link to this item:
|Title:||Laser induced removal of spherical particles from silicon wafers|
|Authors:||Lu, Y.F. |
|Citation:||Lu, Y.F.,Zheng, Y.W.,Song, W.D. (2000-02). Laser induced removal of spherical particles from silicon wafers. Journal of Applied Physics 87 (3) : 1534-1539. ScholarBank@NUS Repository.|
|Abstract:||Laser-induced removal of spherical silica particles from silicon wafers was investigated. The cleaning efficiency and laser cleaning thresholds for particles with diameters of 0.5, 1.0, 2.5, and 5.0 μm were carefully measured. It is found that the cleaning efficiency is more sensitive to laser fluence than laser pulse number and repetition frequency. The particle ejecting energies were found to increase with laser fluence. The threshold laser fluences for removing particles with sizes of 0.5 and 1.0 μm are 225 and 100 mJ/cm2, respectively, when KrF excimer laser is used. The threshold laser fluences are only a value below 5.0 mJ/cm2 for particles with a size of 2.5 and 5 μm. A model including both linear expansion and elastic deformation model was proposed to explain the experimental results. With this model, the particle movement and deformation in laser cleaning process were calculated. The expressions for threshold laser fluences were derived. The theoretical predictions are found to be greater than the experimental results. The difference can be explained by the enhancement of light intensity near the contacting area, due to the focusing and scattering by spherical particles. This model is useful to the study of laser cleaning as well as particle adhesion and deformation on solid surfaces. © 2000 American Institute of Physics.|
|Source Title:||Journal of Applied Physics|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Dec 29, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.