Please use this identifier to cite or link to this item:
|Title:||Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package|
|Authors:||Tay, A.A.O. |
|Source:||Tay, A.A.O.,Lee, W.H. (2002). Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package. Proceedings - Electronic Components and Technology Conference : 897-904. ScholarBank@NUS Repository.|
|Abstract:||The transient three-dimensional filling of a overmold ball grid array (BGA) package with 173 wirebonds was simulated using a commercial CFD software. The geometry of the flow front of the molten molding compound and the three dimensional velocity distribution were obtained as a function of time. The analysis was done for two different positions of the gate, one at the middle of a side and the other at a corner. The wire looping process was first simulated to determine the effect of residual stresses. A significant effect of residual stresses in wirebonds was found on wire sweep computations.|
|Source Title:||Proceedings - Electronic Components and Technology Conference|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Dec 16, 2017
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.