Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/73977
Title: Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package
Authors: Tay, A.A.O. 
Lee, W.H.
Issue Date: 2002
Source: Tay, A.A.O.,Lee, W.H. (2002). Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package. Proceedings - Electronic Components and Technology Conference : 897-904. ScholarBank@NUS Repository.
Abstract: The transient three-dimensional filling of a overmold ball grid array (BGA) package with 173 wirebonds was simulated using a commercial CFD software. The geometry of the flow front of the molten molding compound and the three dimensional velocity distribution were obtained as a function of time. The analysis was done for two different positions of the gate, one at the middle of a side and the other at a corner. The wire looping process was first simulated to determine the effect of residual stresses. A significant effect of residual stresses in wirebonds was found on wire sweep computations.
Source Title: Proceedings - Electronic Components and Technology Conference
URI: http://scholarbank.nus.edu.sg/handle/10635/73977
ISSN: 05695503
Appears in Collections:Staff Publications

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