Please use this identifier to cite or link to this item: https://doi.org/10.1109/ESIME.2006.1644060
Title: The role of simulation in failure prediction and design optimization in electronics packaging
Authors: Tay, A.A.O. 
Issue Date: 2006
Source: Tay, A.A.O. (2006). The role of simulation in failure prediction and design optimization in electronics packaging. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006 2006 : -. ScholarBank@NUS Repository. https://doi.org/10.1109/ESIME.2006.1644060
Abstract: This paper discusses the role of computer simulation in predicting failure and in optimizing design in electronics packaging. The role played by simulation in predicting failure is illustrated by the use of the fracture mechanics approach in predicting delamination in plastic IC packages undergoing solder reflow. The role played by simulation in optimizing design of IC packages is illustrated by a parametric study of the effect of compliance on the reliability of copper column interconnected wafer level packages. Based on this study, a novel interconnect design is proposed where the interconnect compliance varies continuously from a low value at the centre of the chip to a high value at the perimeter of the chip. © 2006 IEEE.
Source Title: 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
URI: http://scholarbank.nus.edu.sg/handle/10635/73947
ISBN: 1424402751
DOI: 10.1109/ESIME.2006.1644060
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