Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/73936
Title: The future of electronic products: Conductive 3D printing?
Authors: Diegel, O.
Singamneni, S.
Huang, B.
Gibson, I. 
Issue Date: 2010
Source: Diegel, O.,Singamneni, S.,Huang, B.,Gibson, I. (2010). The future of electronic products: Conductive 3D printing?. Innovative Developments in Design and Manufacturing - Advanced Research in Virtual and Rapid Prototyping : 397-403. ScholarBank@NUS Repository.
Abstract: This paper describes a curved-layer additive manufacturing technology that has the potential to print plastic components with integral conductive polymer electronic circuits. Researchers at AUT University in New Zealand and the National University of Singapore have developed a novel Fused Deposition Modeling (FDM) process in which the layers of material that make up the part are deposited as curved layers instead of the conventional flat layers. This technology opens up possibilities of building curved plastic parts that have conductive electronic tracks and components printed as an integral part of the plastic component, thereby eliminating printed circuit boards and wiring. It is not possible to do this with existing flat-layer additive manufacturing technologies as the continuity of a circuit could be interrupted between the layers. With curved-layer fused deposition modeling (CLFDM) this problem is removed as continuous filaments in 3 dimensions can be produced, allowing for continuous conductive circuits. © 2010 Taylor & Francis Group.
Source Title: Innovative Developments in Design and Manufacturing - Advanced Research in Virtual and Rapid Prototyping
URI: http://scholarbank.nus.edu.sg/handle/10635/73936
ISBN: 9780415873079
Appears in Collections:Staff Publications

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