Please use this identifier to cite or link to this item: https://doi.org/10.1109/ECTC.2006.1645809
Title: Super stretched solder interconnects for wafer level packaging
Authors: Rajoo, R.
Wong, E.H.
Lim, S.S.
Hnin, W.Y.
Seah, S.K.W.
Tay, A.A.O. 
Iyer, M.
Tummala, R.R.
Issue Date: 2006
Citation: Rajoo, R., Wong, E.H., Lim, S.S., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R. (2006). Super stretched solder interconnects for wafer level packaging. Proceedings - Electronic Components and Technology Conference 2006 : 1227-1232. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2006.1645809
Abstract: A cost-effective wafer level packaging technique termed "stretch and break", based on stretching and detachment of solder interconnections, has been established. Excellent coplanarity, essential for wafer level test and burn-in, is inherent in the process. The technique allows the freedom to use solder materials of up to 400°C melting temperature for forming the interconnection. The shape of the interconnection can also be easily manipulated for optimum performance. The mechanical and thermal cycling reliabilities of the stretched solder interconnection has been found to be significantly better than those of conventional solder joints. © 2006 IEEE.
Source Title: Proceedings - Electronic Components and Technology Conference
URI: http://scholarbank.nus.edu.sg/handle/10635/73894
ISBN: 1424401526
ISSN: 05695503
DOI: 10.1109/ECTC.2006.1645809
Appears in Collections:Staff Publications

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