Please use this identifier to cite or link to this item:
|Title:||Super stretched solder interconnects for wafer level packaging|
|Source:||Rajoo, R., Wong, E.H., Lim, S.S., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R. (2006). Super stretched solder interconnects for wafer level packaging. Proceedings - Electronic Components and Technology Conference 2006 : 1227-1232. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2006.1645809|
|Abstract:||A cost-effective wafer level packaging technique termed "stretch and break", based on stretching and detachment of solder interconnections, has been established. Excellent coplanarity, essential for wafer level test and burn-in, is inherent in the process. The technique allows the freedom to use solder materials of up to 400°C melting temperature for forming the interconnection. The shape of the interconnection can also be easily manipulated for optimum performance. The mechanical and thermal cycling reliabilities of the stretched solder interconnection has been found to be significantly better than those of conventional solder joints. © 2006 IEEE.|
|Source Title:||Proceedings - Electronic Components and Technology Conference|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Jan 17, 2018
WEB OF SCIENCETM
checked on Nov 20, 2017
checked on Jan 14, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.