Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/73769
Title: Predicting failure sites and failure modes in an IC package using a variable order boundary element method
Authors: Tay, A.A.O. 
Lee, K.H. 
Zhou, W.
Lim, K.M. 
Issue Date: 2001
Source: Tay, A.A.O.,Lee, K.H.,Zhou, W.,Lim, K.M. (2001). Predicting failure sites and failure modes in an IC package using a variable order boundary element method. Advances in Electronic Packaging 2 : 1271-1278. ScholarBank@NUS Repository.
Abstract: A methodology for predicting sites of thermomechanical failure in an IC package is developed. Singular stress fields around several stress concentration locations in a typical plastic-encapsulated IC package are calculated using special variable-order singular boundary elements and the singular value decomposition method. The strain energy density distributions around all the stress concentration locations are then obtained from the singular stress fields and compared. The most likely failure site as the temperature of the package is raised is then determined as well as the likely modes of failure, ie interfacial delamination or cracking of mold compound.
Source Title: Advances in Electronic Packaging
URI: http://scholarbank.nus.edu.sg/handle/10635/73769
ISBN: 0791835405
Appears in Collections:Staff Publications

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