Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/73763
Title: Popcorn failure and unstable void growth in plastic electronic packages
Authors: Chong, C.W.
Guo, T.F. 
Cheng, L. 
Keywords: FEA
IC packages
Multiaxial straining
Popcorn failure
Unstable void growth
Issue Date: 2002
Source: Chong, C.W.,Guo, T.F.,Cheng, L. (2002). Popcorn failure and unstable void growth in plastic electronic packages. Key Engineering Materials 227 : 61-66. ScholarBank@NUS Repository.
Abstract: In order to gain some insights into popcorn failure in plastic electronic packages, the phenomenon of unstable void growth of an incompressible neo-Hookean solid under non-symmetric loading is examined. A representative material cell containing a single microvoid is employed in the numerical analysis, where the effect of moisture can be easily incorporated; this cell is subjected to combined internal vapor pressure and remote thermal stress. Results have revealed that there is a maximum allowable mean stress, referred as the critical stress, which defines the onset of unstable void growth - the precursor of popcorn failure. Locus of the critical mean stress versus internal vapor pressure is obtained for typical values of initial porosity under uniaxial, equi-biaxial and equi-triaxial strainings. Results have clearly shown that the critical stress depreciates significantly as the internal vapor pressure is increased. This critical mean stress may therefore be perceived as a suitable criterion for initiation of popcorn failure in IC packages.
Source Title: Key Engineering Materials
URI: http://scholarbank.nus.edu.sg/handle/10635/73763
ISSN: 10139826
Appears in Collections:Staff Publications

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