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|Title:||Popcorn failure and unstable void growth in plastic electronic packages|
Unstable void growth
|Citation:||Chong, C.W.,Guo, T.F.,Cheng, L. (2002). Popcorn failure and unstable void growth in plastic electronic packages. Key Engineering Materials 227 : 61-66. ScholarBank@NUS Repository.|
|Abstract:||In order to gain some insights into popcorn failure in plastic electronic packages, the phenomenon of unstable void growth of an incompressible neo-Hookean solid under non-symmetric loading is examined. A representative material cell containing a single microvoid is employed in the numerical analysis, where the effect of moisture can be easily incorporated; this cell is subjected to combined internal vapor pressure and remote thermal stress. Results have revealed that there is a maximum allowable mean stress, referred as the critical stress, which defines the onset of unstable void growth - the precursor of popcorn failure. Locus of the critical mean stress versus internal vapor pressure is obtained for typical values of initial porosity under uniaxial, equi-biaxial and equi-triaxial strainings. Results have clearly shown that the critical stress depreciates significantly as the internal vapor pressure is increased. This critical mean stress may therefore be perceived as a suitable criterion for initiation of popcorn failure in IC packages.|
|Source Title:||Key Engineering Materials|
|Appears in Collections:||Staff Publications|
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