Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/73670
Title: Nano-particle reinforced solders for fine pitch applications
Authors: Mohankumar, K.
Tay, A.A.O. 
Kripesh, V.
Issue Date: 2004
Source: Mohankumar, K.,Tay, A.A.O.,Kripesh, V. (2004). Nano-particle reinforced solders for fine pitch applications. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 455-461. ScholarBank@NUS Repository.
Abstract: In the present study, the influence of nanopowders such as Ni, Cu and Mo on the phase formation, microstructural characteristics, and mechanical behaviour of conventional solder alloys (63Sn/37Pb and Sn/3.8Ag/0.7Cu) has been investigated. The composite solders were prepared by mechanical mixing of Nickel (Ni), copper (Cu), and Molybdenum (Mo) nano powders with solder alloys followed by cold compaction and sintering. The sintered composite solder alloys were characterized by using SEM and EDX to identify the phase formation and morphological features. The addition of metallic nanopowders such as Ni, Cu, and Mo are observed to influence the grain size and interfacial reaction kinetics of solder alloys. The mechanical properties of the composite solders were measured to study the effect of nanoparticles on the deformation mechanisms. © 2004 IEEE.
Source Title: Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
URI: http://scholarbank.nus.edu.sg/handle/10635/73670
ISBN: 0780388216
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

23
checked on Dec 9, 2017

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.