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Title: Nano-particle reinforced solders for fine pitch applications
Authors: Mohankumar, K.
Tay, A.A.O. 
Kripesh, V.
Issue Date: 2004
Citation: Mohankumar, K.,Tay, A.A.O.,Kripesh, V. (2004). Nano-particle reinforced solders for fine pitch applications. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 455-461. ScholarBank@NUS Repository.
Abstract: In the present study, the influence of nanopowders such as Ni, Cu and Mo on the phase formation, microstructural characteristics, and mechanical behaviour of conventional solder alloys (63Sn/37Pb and Sn/3.8Ag/0.7Cu) has been investigated. The composite solders were prepared by mechanical mixing of Nickel (Ni), copper (Cu), and Molybdenum (Mo) nano powders with solder alloys followed by cold compaction and sintering. The sintered composite solder alloys were characterized by using SEM and EDX to identify the phase formation and morphological features. The addition of metallic nanopowders such as Ni, Cu, and Mo are observed to influence the grain size and interfacial reaction kinetics of solder alloys. The mechanical properties of the composite solders were measured to study the effect of nanoparticles on the deformation mechanisms. © 2004 IEEE.
Source Title: Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
ISBN: 0780388216
Appears in Collections:Staff Publications

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