Nanoindentation study of sputtered Al-Cu thin films for interconnect applications

Please use this identifier to cite or link to this item: https://doi.org/10.1109/EPTC.2006.342774

Title:	Nanoindentation study of sputtered Al-Cu thin films for interconnect applications
Authors:	Kumar, A. Jayaganthan, R. Chandra, R. Chawla, V. Tay, A.A.O.
Issue Date:	2006
Citation:	Kumar, A.,Jayaganthan, R.,Chandra, R.,Chawla, V.,Tay, A.A.O. (2006). Nanoindentation study of sputtered Al-Cu thin films for interconnect applications. Proceedings of the Electronic Packaging Technology Conference, EPTC : 560-564. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2006.342774
Abstract:	Al-Cu thin films were deposited by DC-magnetron sputtering. The formation of different phases and microstructures of Al-Cu thin films were characterised by using XRD and AFM technqiues. The mechanical properties of the Al-Cu thin films were measured by CSEM Nanoindentation technique. It was found that the higher hardness and Young modulus of Al-Cu thin films is due to presence of precipitate and ductile phases in the film. The nanosized grain morphology improves the strength of Al-Cu thin film significantly. © 2006 IEEE.
Source Title:	Proceedings of the Electronic Packaging Technology Conference, EPTC
URI:	http://scholarbank.nus.edu.sg/handle/10635/73664
ISBN:	142440665X
DOI:	10.1109/EPTC.2006.342774
Appears in Collections:	Staff Publications

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