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|Title:||Nanoindentation study of sputtered Al-Cu thin films for interconnect applications|
|Source:||Kumar, A.,Jayaganthan, R.,Chandra, R.,Chawla, V.,Tay, A.A.O. (2006). Nanoindentation study of sputtered Al-Cu thin films for interconnect applications. Proceedings of the Electronic Packaging Technology Conference, EPTC : 560-564. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2006.342774|
|Abstract:||Al-Cu thin films were deposited by DC-magnetron sputtering. The formation of different phases and microstructures of Al-Cu thin films were characterised by using XRD and AFM technqiues. The mechanical properties of the Al-Cu thin films were measured by CSEM Nanoindentation technique. It was found that the higher hardness and Young modulus of Al-Cu thin films is due to presence of precipitate and ductile phases in the film. The nanosized grain morphology improves the strength of Al-Cu thin film significantly. © 2006 IEEE.|
|Source Title:||Proceedings of the Electronic Packaging Technology Conference, EPTC|
|Appears in Collections:||Staff Publications|
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