Please use this identifier to cite or link to this item: https://doi.org/10.1109/EPTC.2006.342774
Title: Nanoindentation study of sputtered Al-Cu thin films for interconnect applications
Authors: Kumar, A.
Jayaganthan, R.
Chandra, R.
Chawla, V.
Tay, A.A.O. 
Issue Date: 2006
Source: Kumar, A.,Jayaganthan, R.,Chandra, R.,Chawla, V.,Tay, A.A.O. (2006). Nanoindentation study of sputtered Al-Cu thin films for interconnect applications. Proceedings of the Electronic Packaging Technology Conference, EPTC : 560-564. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2006.342774
Abstract: Al-Cu thin films were deposited by DC-magnetron sputtering. The formation of different phases and microstructures of Al-Cu thin films were characterised by using XRD and AFM technqiues. The mechanical properties of the Al-Cu thin films were measured by CSEM Nanoindentation technique. It was found that the higher hardness and Young modulus of Al-Cu thin films is due to presence of precipitate and ductile phases in the film. The nanosized grain morphology improves the strength of Al-Cu thin film significantly. © 2006 IEEE.
Source Title: Proceedings of the Electronic Packaging Technology Conference, EPTC
URI: http://scholarbank.nus.edu.sg/handle/10635/73664
ISBN: 142440665X
DOI: 10.1109/EPTC.2006.342774
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