Please use this identifier to cite or link to this item:
|Title:||Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites|
Wettability and mechanical properties
|Citation:||Nai, S.M.L., Wei, J., Gupta, M. (2006-05-10). Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites. Thin Solid Films 504 (1-2) : 401-404. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2005.09.057|
|Abstract:||In the present study, two sets of Sn-3.5 Ag-0.7 Cu solder-based composite materials were successfully synthesized using the powder metallurgy route of blending, compaction, sintering and extrusion. Varying amount of titanium diboride particulates and multi-walled carbon nanotubes were introduced respectively as reinforcements to obtain the two sets of composite solders. Following synthesis, the extruded materials were characterized in terms of their wettability and mechanical properties. Wettability property of the composite solder was found to improve with a threshold addition of reinforcements. Moreover, the results of mechanical properties characterization exhibited enhanced overall strength of the composite solders. An attempt is made in the present study to correlate the variation in amount of the reinforcements with the properties of the resultant nanocomposite materials. © 2005 Elsevier B.V. All rights reserved.|
|Source Title:||Thin Solid Films|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Nov 19, 2018
WEB OF SCIENCETM
checked on Oct 23, 2018
checked on Oct 6, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.