Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/73503
Title: High frequency characterization of 100 micron pitch wafer level package interconnects
Authors: Jayabalan, J. 
Rotaru, M.D.
Issue Date: 2005
Source: Jayabalan, J.,Rotaru, M.D. (2005). High frequency characterization of 100 micron pitch wafer level package interconnects. Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 1 : 171-174. ScholarBank@NUS Repository.
Abstract: In this paper, the characterization of wafer level packages with different types of 100 micron pitch off-chip interconnects in an elastomer probe based test bench is described. The simulated and measured time domain data demonstate 5 gigabit per second performance with the interconnects. Insertion loss of about 3 dB and return loss of 10 dB arc obtained at 5 GHz from frequency domain measurements. © 2005 IEEE.
Source Title: Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
URI: http://scholarbank.nus.edu.sg/handle/10635/73503
ISBN: 0780395786
Appears in Collections:Staff Publications

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