Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/73482
Title: Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications
Authors: Jayaganthan, R. 
Mohankumar, K.
Tay, A.A.O. 
Kripesh, V.
Issue Date: 2004
Source: Jayaganthan, R.,Mohankumar, K.,Tay, A.A.O.,Kripesh, V. (2004). Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applications. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 620-624. ScholarBank@NUS Repository.
Abstract: In the present study Sn-Ag/Au/Ni-P/Cu, Sn-Ag-Cu/Au/Ni-P/Cu, and Sn-Ag-Bi/Au/Ni-P/Cu diffusion couples were prepared by reflowing the Pb free solders on the top surface metallization of the substrate at 250°C. The diffusion couples were annealed at 150°C up to 4, 8, 16, 36, 45 days. The growth of IMCs formed among the different elements in the solder alloys was studied and their morphology were characterised by Fractal Dimension using SEM micrographs. The role of processing parameters on different morphological features was studied in detail. The Box counting technique has been used to measure the fractal dimension of the IMCs. It has been observed that the morphology of the IMC varies from scallop to planar with increasing annealing time. © 2004 IEEE.
Source Title: Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
URI: http://scholarbank.nus.edu.sg/handle/10635/73482
ISBN: 0780388216
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