Please use this identifier to cite or link to this item:
|Title:||Failure mechanisms of interconnections in drop impact|
|Citation:||Seah, S.K.W., Wong, E.H., Mai, Y.W., Rajoo, R., Lim, C.T. (2006). Failure mechanisms of interconnections in drop impact. Proceedings - Electronic Components and Technology Conference 2006 : 1484-1492. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2006.1645852|
|Abstract:||This study performs experimental tracking of crack propagation (Stage II fatigue) in a single solder interconnection during drop impact. A high resolution, high-speed four-point resistance measurement system is used for tracking crack progression. Results indicate that most of the drop impact low-cycle fatigue life of the solder joint is spent in the crack initiation stage. Cross-sections and fractographs show that various mixes of intermetallic and bulk failure are possible within a single joint. Several failure mechanisms are suggested. Comparisons of failure modes are also made between drop impact, quasi-static loading and high-cycle fatigue. A thorough understanding of failure mechanisms is important for the development of failure criteria and life prediction models for drop impact. ©2006 IEEE.|
|Source Title:||Proceedings - Electronic Components and Technology Conference|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Sep 20, 2018
WEB OF SCIENCETM
checked on Sep 10, 2018
checked on Jul 27, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.