Please use this identifier to cite or link to this item: https://doi.org/10.1109/ECTC.2006.1645852
Title: Failure mechanisms of interconnections in drop impact
Authors: Seah, S.K.W.
Wong, E.H.
Mai, Y.W.
Rajoo, R.
Lim, C.T. 
Issue Date: 2006
Source: Seah, S.K.W., Wong, E.H., Mai, Y.W., Rajoo, R., Lim, C.T. (2006). Failure mechanisms of interconnections in drop impact. Proceedings - Electronic Components and Technology Conference 2006 : 1484-1492. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2006.1645852
Abstract: This study performs experimental tracking of crack propagation (Stage II fatigue) in a single solder interconnection during drop impact. A high resolution, high-speed four-point resistance measurement system is used for tracking crack progression. Results indicate that most of the drop impact low-cycle fatigue life of the solder joint is spent in the crack initiation stage. Cross-sections and fractographs show that various mixes of intermetallic and bulk failure are possible within a single joint. Several failure mechanisms are suggested. Comparisons of failure modes are also made between drop impact, quasi-static loading and high-cycle fatigue. A thorough understanding of failure mechanisms is important for the development of failure criteria and life prediction models for drop impact. ©2006 IEEE.
Source Title: Proceedings - Electronic Components and Technology Conference
URI: http://scholarbank.nus.edu.sg/handle/10635/73461
ISBN: 1424401526
ISSN: 05695503
DOI: 10.1109/ECTC.2006.1645852
Appears in Collections:Staff Publications

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