Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/73409
Title: Effects of ball pad configuration on joint reliability in BGA chip-scale packages
Authors: Chong, V.
Kheng, L.T.
Teck, L.C. 
Gunawan, D.K.
Issue Date: 2004
Source: Chong, V.,Kheng, L.T.,Teck, L.C.,Gunawan, D.K. (2004). Effects of ball pad configuration on joint reliability in BGA chip-scale packages. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 735-739. ScholarBank@NUS Repository.
Abstract: The drive for thinner, lighter, smaller semiconductor packages has produced not only a variety of advanced package configurations but numerous packaging concerns, including joint reliability, moisture-induced reliability, warpage, and coplanarity. One critical concern is the joint reliability of unique ball pad configurations in chip-scale packages (CSPs) rendered by the advancement of the micro-via technologies. This study examines the effects of ball pad configurations on solder joint integrity and reliability, with its focus on a conventional pad versus a via-defined pad configuration on bismaleimide triazine (BT) and flex interposers. The assessment of board-level reliability was correlated to solder ball shear tests and a simplified analytical model for further insights into the failure mechanism. © 2004 IEEE.
Source Title: Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
URI: http://scholarbank.nus.edu.sg/handle/10635/73409
ISBN: 0780388216
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