Dynamic and quasi-static three dimensional simulation of wire-looping process in wirebonding

Abstract

This paper describes a three-dimensional, dynamic finite element simulation of the wirelooping process in ball-wedge wirebonding. The three-dimensional geometry of the wirebonder capilliary is utilised and the free interaction between the capilliary and the wire simulated. Previous simulations, based on quasi-static analysis, produced good agreement between simulated and actual wirebond profiles. Hence in this paper, the simulation is further developed to include dynamic effects. The bonding times for various steps of the wire bonding process were estimated from a high-speed video of a typical wirebonding process. Based on that and the strain changes obtained in the quasi-static simulation of the wire looping process, the strain rate profile along the wirebond is obtained and discussed.