Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/73379
Title: Dynamic and quasi-static three dimensional simulation of wire-looping process in wirebonding
Authors: Tay, A.A.O. 
Ng, B.H.
Ong, S.H.
Issue Date: 2003
Source: Tay, A.A.O.,Ng, B.H.,Ong, S.H. (2003). Dynamic and quasi-static three dimensional simulation of wire-looping process in wirebonding. Proceedings - Electronic Components and Technology Conference : 1330-1333. ScholarBank@NUS Repository.
Abstract: This paper describes a three-dimensional, dynamic finite element simulation of the wirelooping process in ball-wedge wirebonding. The three-dimensional geometry of the wirebonder capilliary is utilised and the free interaction between the capilliary and the wire simulated. Previous simulations, based on quasi-static analysis, produced good agreement between simulated and actual wirebond profiles. Hence in this paper, the simulation is further developed to include dynamic effects. The bonding times for various steps of the wire bonding process were estimated from a high-speed video of a typical wirebonding process. Based on that and the strain changes obtained in the quasi-static simulation of the wire looping process, the strain rate profile along the wirebond is obtained and discussed.
Source Title: Proceedings - Electronic Components and Technology Conference
URI: http://scholarbank.nus.edu.sg/handle/10635/73379
ISSN: 05695503
Appears in Collections:Staff Publications

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