Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/73265
Title: Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects
Authors: Liao, E.B.
Tay, A.A.O. 
Ang, S.S.T.
Feng, H.H.
Nagarajan, R.
Kripesh, V.
Kumar, R.
Mahadevan, I.
Issue Date: 2005
Source: Liao, E.B.,Tay, A.A.O.,Ang, S.S.T.,Feng, H.H.,Nagarajan, R.,Kripesh, V.,Kumar, R.,Mahadevan, I. (2005). Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects. Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 1 : 209-214. ScholarBank@NUS Repository.
Abstract: In this paper, macro- and micro-modeling technique is implemented to correlate the compliance, deformation and thermal fatigue damage of composite interconnect structures that consist of copper columns and solder joint. Systematic simulation results reveal the dependence of solder joint fatigue life upon four geometric parameters such as column height, column radius, solder volume and substrate pad radius. A simple model has been developed to explain the dependence of plastic strain on the interconnect compliance. This work provides guidance for design of composite interconnect structure that is meant to enhance the solder joint reliability by incorporation of flexible strucutres. © 2005 IEEE.
Source Title: Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
URI: http://scholarbank.nus.edu.sg/handle/10635/73265
ISBN: 0780395786
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