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|Title:||An experimental study of air and mist cooling of microchannels on IC chips|
|Authors:||Tay, A.A.O. |
|Citation:||Tay, A.A.O.,Ang, S.S.T.,Lwin, L.O. (2006). An experimental study of air and mist cooling of microchannels on IC chips. Proceedings of the Electronic Packaging Technology Conference, EPTC : 353-359. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2006.342742|
|Abstract:||This paper describes an experimental study of air and mist cooling of microchannels fabricated on the back of a silicon chip. A rig was designed and fabricated for the experimental study. The test section consisted of a 21mm × 21mm square silicon die with 100μm-wide microchannels etched on its back surface, which were covered with a glass plate to confine the flow through the microchannels. A slot was machined across the glass cover plate to admit air from an inlet manifold. The performance of an air-water mist spray cooling system was also studied experimentally. It was found that an air-water mist spray cooling system can give a higher cooling rate than air-only slot-impingement cooling of microchannels. For the same heat dissipation, it was found that the air-water mist spray cooling system required a much smaller flow rate of air. Comparing with data available in the literature, it was also found that mist cooling of microchannels was much more effective than on plane surfaces. © 2006 IEEE.|
|Source Title:||Proceedings of the Electronic Packaging Technology Conference, EPTC|
|Appears in Collections:||Staff Publications|
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