Please use this identifier to cite or link to this item: https://doi.org/10.1007/s00542-006-0126-y
Title: A dielectrophoretic chip packaged at wafer level
Authors: Iliescu, C.
Tay, F.E.H. 
Xu, G.
Yu, L.M. 
Samper, V.
Issue Date: Sep-2006
Citation: Iliescu, C., Tay, F.E.H., Xu, G., Yu, L.M., Samper, V. (2006-09). A dielectrophoretic chip packaged at wafer level. Microsystem Technologies 12 (10-11) : 987-992. ScholarBank@NUS Repository. https://doi.org/10.1007/s00542-006-0126-y
Abstract: The paper presents a dielectrophoretic chip, fully enclosed, with bulk silicon electrodes fabricated using wafer-to-wafer bonding techniques and packaged at the wafer level. The silicon electrodes, which are bonded to two glass dies, define in the same time the walls of the microfluidic channel. The device is fabricated from a silicon wafer that is bonded (at wafer level) anodically and using SU8 photoresist between two glass wafers. The first glass die includes drilled holes for inlet/outlet connections while the second glass die assure the electrical connections, through via holes and a metallization layer, between the silicon electrodes and a printing circuit board.
Source Title: Microsystem Technologies
URI: http://scholarbank.nus.edu.sg/handle/10635/73017
ISSN: 09467076
DOI: 10.1007/s00542-006-0126-y
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