Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/72808
Title: Novel electrical performance analysis for leaded packages
Authors: Jin, Z.
Ma, J.
Iyer, M.K. 
Ooi, B.L. 
Leong, M.S. 
Issue Date: 1998
Source: Jin, Z.,Ma, J.,Iyer, M.K.,Ooi, B.L.,Leong, M.S. (1998). Novel electrical performance analysis for leaded packages. IEEE Topical Meeting on Electrical Performance of Electronic Packaging : 101-104. ScholarBank@NUS Repository.
Abstract: This paper presents a novel analysis of electrical performance in 208PQFP. S-parameters are used to model the package leads. Simultaneous switching noise (SSN) is analysed both in time and frequency domain. Higher frequency effects, such as resonance and reflection are also included in this simulation study.
Source Title: IEEE Topical Meeting on Electrical Performance of Electronic Packaging
URI: http://scholarbank.nus.edu.sg/handle/10635/72808
Appears in Collections:Staff Publications

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