Please use this identifier to cite or link to this item: https://doi.org/10.1117/12.596288
Title: Ultrafast laser processing of transparent materials
Authors: Wang, Z.B.
Hong, M.H. 
Yin, L.
Chong, T.C. 
Keywords: Cracks
Far-field
Near-field
Transparent materials
Ultrafast laser
Issue Date: 2004
Source: Wang, Z.B., Hong, M.H., Yin, L., Chong, T.C. (2004). Ultrafast laser processing of transparent materials. Proceedings of SPIE - The International Society for Optical Engineering 5662 : 215-220. ScholarBank@NUS Repository. https://doi.org/10.1117/12.596288
Abstract: The advantages of ultrafast laser processing of materials include a minimal thermal penetration region and low processing temperature, precision removal of material, and good-quality feature definition. In this paper, fs laser (800 nm, 100 fs) processing of transparent materials at different focus positions and different laser intensities is investigated. Different morphologies are presented and compared. It is found that at controlled laser fluences, both bowl-shape and hump-like microstructures can be produced at the material surfaces. The lengths of the cracks produced inside the bulk material were measured as a function of the focus positions. The physical mechanisms for the formation of different microstructures are discussed. To reduce the patterning size, we employ transparent particles as microlens on the surfaces by self-assembly. Parallel structures in nanometer scale were produced by single fs laser pulse irradiation. These nanostructures change their shapes at different laser energies. The optical near-field distribution around the particle was also calculated according to exact solution of light scattering problem.
Source Title: Proceedings of SPIE - The International Society for Optical Engineering
URI: http://scholarbank.nus.edu.sg/handle/10635/72115
ISSN: 0277786X
DOI: 10.1117/12.596288
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